In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it. Swimming Pool Filter
![Trouble in Your Tank: Acid Copper Plating :: I-Connect007](http://cdn.globalso.com/ltanks/IMG_9875.jpg)
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
Electroplating a printed circuit board is by no means a trivial task. Higher layer counts, smaller-diameter vias (through-hole and blind) as well as higher-performance material sets contribute to the greater degree of difficulty with today’s technology. So, process engineers pay close attention to the “softer” issues such as cathode current density, solution chemistry (copper sulfate and sulfuric acid concentration) and addition agent control (well, sometime!).
The concern here is that acid copper pattern plating of a printed circuit board has many more critical aspects that must be diligently controlled for optimum performance. These include solution agitation and filtration, anode length and placement, current distribution effects, reducing electrical resistance in the plating cell, photoresist development and controlled organic contamination in the plating solutions. These are the subjects of this article.
For uniform surface plating distribution, a homogeneous mixing of the electrolyte is necessary to avoid overplating the surface while the through-hole or blind via is being plated from the bottom up. The engineer should adjust flow rates so as to not create an excessively turbulent solution movement.
Solution agitation of the copper plating electrolyte maybe accomplished with air agitation, eductors, solution impingement and/or cathode bar movement. The main purposes of agitation have been stated many times and include:
![Trouble in Your Tank: Acid Copper Plating :: I-Connect007](http://cdn.globalso.com/ltanks/Case-study-14.jpg)
Gas Cylinder For Ghana To read the full version of this article which appeared in the January 2017 issue of the PCB Magazine, click here.