The basis of chaos theory is a key concept known as the “butterfly effect.” It’s the idea that a small event in one place creates a cascading set of events elsewhere. So, how is the EMS landscape changing? We’re tracking the concerns and dynamics of this landscape, and there’s a lot to learn.
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry. ASSEMBLEON MACHINE BOARD
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC announces the release of revisions for two leading standards for the electronics assembly industry. IPC J-STD-001J, Requirements for Soldered Electrical and Electronic Assemblies is recognized as the sole industry-consensus standard for soldering processes and materials. IPC-A-610J, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry. These two documents are often used together for the manufacture of electronic assemblies.
Revisions to these standards are completed every three years, with significant changes made to each one. Clear guidance on the use of the standard can be found in the first chapter of each document. Committee leaders addressed more than 1,350 comments for revision “J.” Some of the significant changes found in the standards are as follows:
Global changes implemented in both documents:
Changes to IPC J-STD-001J (Representatives from 27 countries worked on the standard):
Changes to IPC-A-610J (Representatives from 29 countries worked on the standard):
ASSEMBLEON FEEDER BOARDS In addition to the new revisions for IPC J-STD-001J and IPC-A-610J, redline documents are also available. A white paper is available IPC-WP-028, Guidance on Objective Evidence for Validating the Acceptability of Bubbles in Conformal Coatings.