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Infineon Technologies AG of Munich, Germany is expanding its portfolio of CoolSiC MOSFET discretes 650V by introducing two new product families housed in the Thin-TOLL 8x8 and TOLT packages, enabling maximum utilization of the PCB mainboard and daughter cards while also taking the system’s thermal requirements and space restrictions into account. Dfn 3x3 Ep Mosfets
The new product families are based on the CoolSiC Generation 2 (G2) technology, offering significantly improved figures-of-merit, reliability and ease of use. Both product families specifically target high and medium switching-mode power supplies (SMPS), including artificial intelligence (AI) servers, renewable energy, electric vehicle (EV) chargers, and large home appliances.
The Thin-TOLL package has a form factor of 8mm x 8mm and offers what is claimed to be the best-in-class thermal cycling on board (TCoB) capability on the market. The TOLT package is a top-side-cooled (TSC) enclosure with a similar form factor to TOLL.
Both package types are said to offer developers several benefits: Using them in AI and server power supply units (PSUs), for example, reduces the thickness and length of the daughter cards and allows for a flat heat sink. When used in micro-inverters, 5G PSU, TV PSU and SMPS, the Thin-TOLL 8x8 package allows for a minimization of the PCB area occupied by the power supply devices on the mainboard, while TOLT keeps the junction temperature of the devices under control, given that these applications typically use convection cooling. In addition, TOLT devices complete Infineon's top-side-cooled CoolSiC industrial portfolio, namely CoolSiC 750V in Q-DPAK. They enable developers to reduce the PCB footprint occupied by SiC MOSFETs when the power to be delivered to the devices does not require a Q-DPAK package.
The CoolSiC MOSFETs 650V G2 in ThinTOLL 8x8 and TOLT are now available with on-resistances RDS(on) of 20mΩ, 40mΩ, 50mΩ and 60mΩ. Additionally, the TOLT variant is also available with an RDS(on) of 15mΩ. The product family will be expanded by a more granular portfolio by the end of 2024.
Infineon’s CoolSiC MOSFET 650V Generation 2 devices are being showcased in booths #470 and #169 (Hall 7) at Power, Control and Intelligent Motion (PCIM) Europe 2024 in Nuremberg, Germany (11–13 June). Company representatives are also giving several presentations at the accompanying PCIM Conference and Forums, followed by discussions with the speakers.
Infineon launches CoolSiC MOSFET Generation 2
Infineon adds 650V TOLL portfolio to CoolSiC MOSFET family
Visit: www.mesago.de/en/PCIM/
Visit: www.infineon.com/coolsic
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