In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it. 2layer flex rigd
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
This paper discusses a through-hole copper filling process for application in high-density interconnect constructions on thin IC and LED substrates where high reliability and thermal management are essential. The process consists of a two-step acid copper plating cycle. The first step utilizes periodic pulse reverse (PPR) electroplating to form a conductive copper bridge across the middle of a through-hole and is followed by direct current electroplating to fill the resultant vias formed in the bridge cycle.
The ability of the process to fill a variety of through-hole sizes on substrates of varying thickness while minimizing the overall surface copper build-up are critical in applications requiring efficient thermal management as circuit miniaturization continues.
The through-hole fill technology and factors that affect its performance such as substrate thickness and through-hole diameter will be presented in this paper.
Resin or paste plugging of through-holes in cores has been a part of build-up technology, especially in IC substrate construction, for many years. Technological advances encompassing increased circuit density and stacked via construction, coupled with higher power devices, have added an extra dimension of thermal management where a copper filled through-hole becomes advantageous (Figure 1).
Advantages of copper filled through-holes include:
New technologies were developed to completely fill through-holes and vias in build-up core layers in HDI and IC substrates with solid copper. Among the approaches for filling through-holes in a thin core board with copper was DC plating.
flexible pcb assembly To read this article which appeared in the January 2017 issue of The PCB Magazine, click here.